The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2025

Filed:

Aug. 10, 2022
Applicant:

Google Llc, Mountain View, CA (US);

Inventors:

Emad Samadiani, Cypress, CA (US);

Padam Jain, San Jose, CA (US);

Yingshi Tang, Danville, CA (US);

Sue Yun Teng, Belmont, CA (US);

Nicholas Chao Wei Wong, San Jose, CA (US);

Kieran Miller, Palo Alto, CA (US);

Sudharshan Sugavanesh Udhayakumar, San Jose, CA (US);

Assignee:

Google LLC, Mountain View, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3677 (2013.01); H01L 23/49816 (2013.01); H01L 24/16 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/16225 (2013.01);
Abstract

A compliant pad spacer utilized in a three-dimensional IC packaging is provided. The compliant pad spacer may be utilized to provide adequate support among the substrates or boards, such as packing substrates, interposers or print circuit broads (PCBs), so as to minimize the effects of substrate warpage or structural collapse in the IC packaging. In one example, the compliant pad spacer includes an insulating material, such as silicon-based polymer composites having ceramic fillers disposed therein.


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