This inventor holds 6 USPTO granted patents and 2 published patent applications and 2 EPO patents. Top assignees: Google Inc., Cisco Technology, Inc.. Active years: 2009-2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2009-2025
Title: Sue Yun Teng: Innovator in Integrated Circuit Packaging
Introduction
Sue Yun Teng is a prominent inventor based in Belmont, CA (US). She has made significant contributions to the field of integrated circuit packaging, holding a total of 6 patents. Her innovative designs focus on enhancing the reliability and efficiency of electronic components.
Latest Patents
One of her latest patents is the "Compliant pad spacer for three-dimensional integrated circuit package." This invention provides a compliant pad spacer that supports substrates or boards, such as packing substrates, interposers, or printed circuit boards (PCBs). It minimizes the effects of substrate warpage or structural collapse in IC packaging. The compliant pad spacer includes an insulating material, such as silicon-based polymer composites with ceramic fillers.
Another notable patent is the "Cooling heatshield for clamshell BGA rework." This invention features a heatshield that can be actively cooled during the rework process. It includes a backer plate and a metal plate, with vents that direct cooling gas towards the metal plate and a first ball grid array (BGA) package. This cooling mechanism helps maintain the solder joint temperature below reflow and solidus temperatures, preventing defects during the rework of a second BGA package.
Career Highlights
Sue has worked with leading technology companies, including Google Inc. and Cisco Technology, Inc. Her experience in these organizations has allowed her to develop and refine her innovative ideas in the field of electronics.
Collaborations
Throughout her career, Sue has collaborated with talented individuals such as Shinnosuke Yamamoto and Mudasir Ahmad. These partnerships have contributed to her success and the advancement of her inventions.
Conclusion
Sue Yun Teng is a remarkable inventor whose work in integrated circuit packaging has led to significant advancements in the field. Her innovative patents and collaborations with industry leaders highlight her contributions to technology and electronics.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile