The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 04, 2025

Filed:

Aug. 29, 2023
Applicant:

Google Llc, Mountain View, CA (US);

Inventor:

Sue Yun Teng, Belmont, CA (US);

Assignee:

Google LLC, Mountain View, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/467 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/467 (2013.01); H01L 23/49816 (2013.01);
Abstract

The present disclosure provides for a heatshield that can be actively cooled during a rework process. The heatshield may include a backer plate and a metal plate. A plurality of vents may extend from air inlet ducts to a top surface of the backer plate such that the plurality of vents directs cooling gas forced into the heatshield towards the metal plate and a first ball grid array (BGA) package. The cooling gas may maintain the solder joint temperature of the first BGA package below a reflow temperature and below a solidus temperature to prevent reflow-related solder joint defects from occurring in the first BGA package during rework of a second BGA package.


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