Sudharshan Sugavanesh Udhayakumar

Title: Sudharshan Sugavanesh Udhayakumar: Innovator in Integrated Circuit Packaging

Introduction

Sudharshan Sugavanesh Udhayakumar is a notable inventor based in San Jose, California. He has made significant contributions to the field of integrated circuit packaging, holding two patents that showcase his innovative approach to technology.

Latest Patents

His latest patents include a "Compliant Pad Spacer for Three-Dimensional Integrated Circuit Package." This invention provides a compliant pad spacer that supports substrates or boards, such as packing substrates, interposers, or printed circuit boards (PCBs). It minimizes the effects of substrate warpage or structural collapse in IC packaging. The compliant pad spacer is made from an insulating material, such as silicon-based polymer composites with ceramic fillers.

Another significant patent is the "Temperature Control Element Utilized in Device Die Packages." This invention features an IC die with a temperature control element designed for three-dimensional IC packages. It enhances thermal control and management, assisting in the temperature regulation of the IC die during operation. The temperature control element includes thermal dissipating features on the IC die's surface, efficiently managing thermal energy.

Career Highlights

Sudharshan currently works at Google Inc., where he continues to innovate in the field of integrated circuits. His work focuses on improving the efficiency and performance of IC packaging technologies.

Collaborations

Throughout his career, Sudharshan has