The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2024
Filed:
Jan. 07, 2022
Google Llc, Mountain View, CA (US);
Yingying Wang, Sunnyvale, CA (US);
Emad Samadiani, Cypress, CA (US);
Madhusudan K. Iyengar, Foster City, CA (US);
Padam Jain, San Jose, CA (US);
Xiaojin Wei, Dublin, CA (US);
Teckgyu Kang, Saratoga, CA (US);
Sudharshan Sugavanesh Udhayakumar, Santa Clara, CA (US);
Yingshi Tang, Danville, CA (US);
Google LLC, Mountain View, CA (US);
Abstract
An IC die includes a temperature control element suitable for three-dimensional IC package with enhanced thermal control and management. The temperature control element may assist temperature control of the IC die when in operation. In one example, the temperature control element may have a plurality of thermal dissipating features disposed on a first surface of the IC die to efficiently control and dissipate the thermal energy from the IC die when in operation. A second surface opposite to the first surface of the IC die may include a plurality of devices, such as semiconductors transistors, devices, electrical components, circuits, or the like, that may generate thermal energy when in operation. The temperature control element may provide an IC die with high efficiency of heat dissipation that is suitable for 3D IC package structures and requirements.