This inventor holds 1 USPTO granted patent. Top assignee: Google Inc.. Active years: 2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025
Title: Kieran Miller: Innovator in Integrated Circuit Packaging
Introduction
Kieran Miller is a notable inventor based in Palo Alto, California. He has made significant contributions to the field of integrated circuit packaging, showcasing his innovative spirit and technical expertise.
Latest Patents
Kieran holds a patent for a "Compliant pad spacer for three-dimensional integrated circuit package." This invention provides a compliant pad spacer that is utilized in three-dimensional IC packaging. The compliant pad spacer is designed to offer adequate support among substrates or boards, such as packing substrates, interposers, or printed circuit boards (PCBs). It minimizes the effects of substrate warpage or structural collapse in IC packaging. The compliant pad spacer includes an insulating material, such as silicon-based polymer composites with ceramic fillers.
Career Highlights
Kieran Miller is currently employed at Google Inc., where he continues to push the boundaries of technology and innovation. His work focuses on enhancing the reliability and performance of integrated circuits through innovative packaging solutions.
Collaborations
Kieran collaborates with talented individuals such as Emad Samadiani and Padam Jain, contributing to a dynamic and innovative work environment.
Conclusion
Kieran Miller's contributions to integrated circuit packaging exemplify the spirit of innovation. His patent and work at Google Inc. highlight his commitment to advancing technology in this critical field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile