logo

For the Inventor, By the Inventor

Hsinchu, Taiwan

Oscar M K Law

This inventor holds 16 USPTO granted patents and 1 published patent application. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2011-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Oscar M K Law. Retrieved from https://idiyas.com/inventor/oscar-m-k-law

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 16 

% Patents Active = 62.5

Average Co-Inventor Count = 2.3

ph-index = 8

Forward Citations = 246(Granted Patents)


Company Filing History:

goldMedal16 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2011-2017

Loading Chart...
16 patents (USPTO):Explore Patents
1. 9559003 - Three-dimensional semiconductor architecture (2017-01-31),
2. 9111936 - Three-dimensional semiconductor architecture (2015-08-18),
3. 9099540 - Three-dimensional system-in-package architecture (2015-08-04),
4. 8753939 - Three-dimensional semiconductor architecture (2014-06-17),
5. 8674510 - Three-dimensional integrated circuit structure having improved power and thermal management (2014-03-18),
6. 8589847 - Circuits and methods for programmable transistor array (2013-11-19),
7. 8552563 - Three-dimensional semiconductor architecture (2013-10-08),
8. 8549460 - Supplying power to integrated circuits using a grid matrix formed of through-silicon vias (2013-10-01),
9. 8487444 - Three-dimensional system-in-package architecture (2013-07-16),
10. 8332794 - Circuits and methods for programmable transistor array (2012-12-11),
11. 8314635 - Methods for forming programmable transistor array comprising basic transistor units (2012-11-20),
12. 8264067 - Through silicon via (TSV) wire bond architecture (2012-09-11),
13. 8247906 - Supplying power to integrated circuits using a grid matrix formed of through-silicon vias (2012-08-21),
14. 8173491 - Standard cell architecture and methods with variable design rules (2012-05-08),
15. 8120086 - Low leakage capacitors including portions in inter-layer dielectrics (2012-02-21),

Title: Oscar M K Law: Innovator in Semiconductor Technology

Introduction

Oscar M K Law is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 16 patents. His work focuses on advancing semiconductor architecture, which is crucial for modern electronic devices.

Latest Patents

One of his latest patents involves a three-dimensional semiconductor architecture. This system and method for making semiconductor die connections utilize through-substrate vias. These vias are formed through the substrate to facilitate signal connections, as well as power and ground connections. In one embodiment, the substrate features an interior region and a periphery region surrounding it. A first set of through-substrate vias is located within the periphery region, while a second set is situated within the interior region, forming part of a power matrix. The second set of through-substrate vias bisects the substrate into two parts, enhancing the efficiency of semiconductor connections.

Career Highlights

Oscar M K Law is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His innovative work has positioned him as a key figure in the development of advanced semiconductor technologies.

Collaborations

He has collaborated with notable coworkers, including Kuo H Wu and Wei-Chih Yeh, contributing to various projects that push the boundaries of semiconductor design and functionality.

Conclusion

Oscar M K Law's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His work continues to shape the future of electronic devices and semiconductor architecture.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…