The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2012
Filed:
Jul. 16, 2010
Oscar M. K. Law, Hsin-Chu, TW;
Kuo H. Wu, Hsin-Chu, TW;
Wei-chih Yeh, Taipei, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A through silicon via architecture for integrated circuits is provided. The integrated circuit (IC) includes a substrate with a top surface and a bottom surface with circuitry formed on the top surface, a plurality of bonding pads formed along a periphery of the bottom surface, and a backside metal layer (BML) formed on the bottom surface and electrically coupled to a second subset of bonding pads in the plurality of bonding pads. A first subset of bonding pads in the plurality of bonding pads is electrically coupled to circuitry on the top surface with through silicon vias (TSV). The BML distributes electrical signals provided by the second subset of bonding pads.