Osaka, Japan

Osamu Inui

USPTO Granted Patents = 6 

 

Average Co-Inventor Count = 5.1

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2013-2024

where 'Filed Patents' based on already Granted Patents

6 patents (USPTO):

Title: Osamu Inui: Innovator in Electronic Components and Heat Dissipation Technology

Introduction

Osamu Inui is a prominent inventor based in Osaka, Japan. He has made significant contributions to the fields of electronic components and heat dissipation technology. With a total of 6 patents to his name, Inui's work has had a considerable impact on the industry.

Latest Patents

Inui's latest patents include innovative methods and products that enhance manufacturing processes and product performance. One of his notable inventions is a method for manufacturing a cured film, which improves the formation accuracy of fine cured product films and enhances adhesion. This method involves applying a photocurable and thermocurable composition using an ink jet device, followed by light irradiation and heating steps. Another significant patent is related to a heat dissipation sheet that effectively enhances adhesiveness and long-term insulation reliability. This sheet incorporates first and second inorganic particles with specific aspect ratios, optimizing its performance.

Career Highlights

Osamu Inui is currently employed at Sekisui Chemical Co., Ltd., where he continues to develop innovative solutions in his field. His expertise in manufacturing processes and material science has positioned him as a key figure in advancing technology related to electronic components and heat management.

Collaborations

Inui has collaborated with notable colleagues, including Hiroshi Maenaka and Mitsuru Tanikawa. Their combined efforts have contributed to the successful development of various technologies and patents.

Conclusion

Osamu Inui's contributions to innovation in electronic components and heat dissipation technology highlight his role as a leading inventor in Japan. His patents reflect a commitment to enhancing product performance and manufacturing efficiency.

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