Sekisui Chemical Co., Ltd.

Osamu Inui

Hiroshi Maenaka

Takashi Watanabe

Mitsuru Tanikawa

Rui Zhang

Keigo Oowashi

Michihisa Ueda

Takanori Inoue

Kouji Ashiba

Ryosuke Takahashi

Yuko Kawahara

Yusuke Fujita

Yoshito Fujita

Shigeru Nakamura

Kazuyuki Yahara

Izumi Matsumoto

Shintaro Moriguchi

Abison Scaria

Yoshitaka Kunihiro

Ryosuke Yamazaki

Ayuko Oki

Tetsurou Yoshioka

Hidehito Nishizawa

Provided is a method for producing a cured product film, which is capable of increasing the formation accuracy of a fine cured product film and also increasing the adhesion of the cured product film. The method for producing a curable film according to the present invention includes an application step in which a curable composition that is photocurable and thermocurable and also is in liquid form is applied using an ink jet device, a first light irradiation step in which the curable composition is irradiated with light from a first light irradiation part, and a heating step in which a precured product film irradiated with light is heated, the ink jet device has an ink tank to store the curable composition, a discharge part, and a circulation flow path part, and in the application step, the curable composition is applied while being circulated in the ink jet device.

Method for manufacturing cured film, method for manufacturing electronic component, and electronic component

Provided is a heat dissipation sheet capable of effectively enhancing adhesiveness and long-term insulation reliability. The heat dissipation sheet according to the present invention contains first inorganic particles having an aspect ratio of 2 or less, second inorganic particles having an aspect ratio of more than 2, and a binder resin. In this heat dissipation sheet, a content of the second inorganic particles is larger than a content of the first inorganic particles in 100% by volume of a region having a thickness of 15% on a first surface side in a thickness direction, and the content of the first inorganic particles in 100% by volume of the region having a thickness of 15% is larger than the content of the first inorganic particles in 100% by volume of a central region having a thickness of 70%.

Heat dissipation sheet, method for producing heat dissipation sheet, and laminate

Provided is a resin material capable of effectively enhancing insulation properties, adhesiveness and long-term insulation reliability. The resin material according to the present invention contains first inorganic particles having an average aspect ratio of 2 or less and an average circularity of 0.90 or less, second inorganic particles having an average aspect ratio of 2 or less and an average circularity of 0.95 or more, third inorganic particles having an average aspect ratio of more than 2, and a binder resin.

Resin material, method for producing resin material, and laminate

There is provided a laminated body capable of lowering thermal resistance and capable of suppressing peeling off after a cooling/heating cycle. The laminated body according to the present invention includes an insulating resin layer, a first metal material being a metal foil or a metal plate, and a second metal material being a metal foil or a metal plate, the first metal material is layered on a first surface of the insulating resin layer and the second metal material is layered on a second surface opposite to the first surface of the insulating resin layer, the thickness of the insulating resin layer is 200 &#x3bc;m or less, the total thickness of the first metal material and the second metal material is 200 &#x3bc;m or more, the ratio of the thickness of the first metal material to the thickness of the second metal material is 0.2 or more and 5 or less, and the ratio of the surface area of a surface opposite to the insulating resin layer side of the first metal material to the surface area of a surface opposite to the insulating resin layer side of the second metal material is 0.5 or more and 2 or less.

Laminated body

The present invention provides a sealant for an optical semiconductor device which is less likely to reduce its luminance and is also less likely to change its color even used in an energized state in harsh environments of high temperature and high humidity. The sealant for an optical semiconductor device includes: a first organopolysiloxane not containing a hydrogen atom bound to a silicon atom, but containing an alkenyl group bound to a silicon atom and an aryl group bound to a silicon atom, a second organopolysiloxane containing a hydrogen atom bound to a silicon atom and an aryl group bound to a silicon atom, and a platinum-alkenyl complex. The platinum-alkenyl complex is a reaction product obtained by reacting chloroplatinic acid hexahydrate with not less than 6 equivalent of a bi- or more-functional alkenyl compound. The ratio of the number of the alkenyl group bound to a silicon atom in the organopolysiloxane to the number of the hydrogen atom bound to a silicon atom in the organopolysiloxane in the sealant is not less than 1.0 and not more than 2.5.

Encapsulant for optical semiconductor device and optical semiconductor device using same

Growing community of inventors

Osaka, Japan

Osamu Inui