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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11492528 B1

PDFFull Text
Date of Patent:
Nov. 08, 2022

Filed:

Jun. 21, 2018

Heat dissipation sheet, method for producing heat dissipation sheet, and laminate

Applicant:

Sekisui Chemical Co., Ltd., Osaka, JP;

Inventors:

Yuko Kawahara, Tsukuba, JP;

Keigo Oowashi, Osaka, JP;

Kouji Ashiba, Osaka, JP;

Rui Zhang, Osaka, JP;

Osamu Inui, Osaka, JP;

Hiroshi Maenaka, Tsukuba, JP;

Assignee:

SEKISUI CHEMICAL CO., LTD., Osaka, JP;

Attorney:

Cheng Law Group, PLLC

Primary Examiner:

Sheeba Ahmed

Int. Cl.
CPC ...
B32B 7/06 (2019.01); B32B 15/09 (2006.01); B32B 15/20 (2006.01); B32B 27/08 (2006.01); B32B 27/20 (2006.01); B32B 27/34 (2006.01); B32B 27/36 (2006.01); B32B 27/06 (2006.01); B32B 27/18 (2006.01); C09K 5/14 (2006.01); C08K 7/00 (2006.01); C08K 3/08 (2006.01); C08K 3/38 (2006.01); H05K 3/38 (2006.01); H05K 7/20 (2006.01); B32B 37/10 (2006.01); H01L 23/373 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); B32B 7/06 (2013.01); B32B 15/09 (2013.01); B32B 15/20 (2013.01); B32B 27/08 (2013.01); B32B 27/20 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); C08K 3/08 (2013.01); C08K 3/38 (2013.01); B32B 37/1018 (2013.01); B32B 2264/107 (2013.01); B32B 2264/1023 (2020.08); B32B 2307/304 (2013.01); B32B 2307/732 (2013.01); C08K 2003/0812 (2013.01); C08K 2003/385 (2013.01); C08K 2201/001 (2013.01); C08K 2201/005 (2013.01); C08K 2201/014 (2013.01); C08K 2201/016 (2013.01); H01L 23/3733 (2013.01); H01L 23/3735 (2013.01); H05K 1/0373 (2013.01); H05K 2201/0209 (2013.01);
Abstract

Provided is a heat dissipation sheet capable of effectively enhancing adhesiveness and long-term insulation reliability. The heat dissipation sheet according to the present invention contains first inorganic particles having an aspect ratio of 2 or less, second inorganic particles having an aspect ratio of more than 2, and a binder resin. In this heat dissipation sheet, a content of the second inorganic particles is larger than a content of the first inorganic particles in 100% by volume of a region having a thickness of 15% on a first surface side in a thickness direction, and the content of the first inorganic particles in 100% by volume of the region having a thickness of 15% is larger than the content of the first inorganic particles in 100% by volume of a central region having a thickness of 70%.

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