Keigo Oowashi

Title: Keigo Oowashi: Innovator in Thermal Conductivity and Insulation

Introduction

Keigo Oowashi is a prominent inventor based in Osaka, Japan, known for his significant contributions to the field of thermal conductivity and insulation materials. With a total of 12 patents to his name, Oowashi has developed innovative solutions that enhance the performance of insulating materials.

Latest Patents

Oowashi's latest patents include an insulating sheet and laminate designed to improve thermal conduction and adhesiveness. The insulating sheet features a thermosetting component and a thermally conductive filler, specifically boron nitride. This design ensures that the first content of boron nitride in a 10% thickness region from the first surface is less than the second content in a 90% thickness region from the second surface. Additionally, his resin material patent focuses on improving insulating properties and thermal conductivity while controlling dielectric breakdown strength and increasing adhesion. This resin material comprises first and second inorganic particles along with a binder resin, with specific compressive strength ratios to optimize performance.

Career Highlights

Throughout his career, Oowashi has worked with notable organizations such as Sekisui Chemical Co., Ltd. and Hiroshima University. His experience in these institutions has allowed him to refine his expertise in material science and innovation.

Collaborations

Oowashi has collaborated with talented individuals in his field, including Kouji Ashiba and Yuko Kawahara. These partnerships have contributed to the advancement of his research and the successful development of his patents.

Conclusion

Keigo Oowashi stands out as a key figure in the innovation of thermal insulation materials, with a strong portfolio of patents that reflect his dedication to enhancing material performance. His work continues to influence the industry and pave the way for future advancements in thermal conductivity.