The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2023
Filed:
Dec. 07, 2018
Applicant:
Sekisui Chemical Co., Ltd., Osaka, JP;
Inventors:
Assignee:
SEKISUI CHEMICAL CO., LTD., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/08 (2006.01); B32B 27/20 (2006.01); B32B 15/092 (2006.01); H01L 23/373 (2006.01); B32B 3/10 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); B32B 3/10 (2013.01); B32B 15/08 (2013.01); B32B 15/092 (2013.01); B32B 27/20 (2013.01); H01L 21/4882 (2013.01); H01L 24/73 (2013.01); B32B 2264/10 (2013.01); B32B 2264/102 (2013.01); B32B 2264/107 (2013.01); B32B 2307/206 (2013.01); B32B 2307/304 (2013.01); B32B 2457/00 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/0503 (2013.01); H01L 2924/05032 (2013.01); H01L 2924/0532 (2013.01); H01L 2924/05432 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/15798 (2013.01);
Abstract
The problem to be solved by the invention is to provide a laminate capable of effectively enhancing thermal conductivity and adhesiveness, in spite of the relatively large thickness of a patterned metal layer. The laminate () according to the present invention includes a metal substrate (), an insulating layer () laminated on one surface of the metal substrate (), and a patterned metal layer () laminated on the surface of the insulating layer () on the side opposite to the metal substrate (), the metal layer () is 300 μm or more in thickness, and the insulating layer () includes boron nitride () and an inorganic filler () other than boron nitride.