Rui Zhang

Title: Rui Zhang - Innovator in Thermal Conductivity Solutions

Introduction

Rui Zhang is a prominent inventor based in Osaka, Japan. He has made significant contributions to the field of materials science, particularly in enhancing thermal conductivity in electronic devices. His innovative approach addresses critical challenges in the industry.

Latest Patents

Rui Zhang holds a patent for a laminate and electronic device. The invention aims to provide a laminate that effectively enhances thermal conductivity and adhesiveness, despite the relatively large thickness of a patterned metal layer. The laminate includes a metal substrate, an insulating layer laminated on one surface of the metal substrate, and a patterned metal layer laminated on the surface of the insulating layer on the side opposite to the metal substrate. The metal layer is 300 µm or more in thickness, and the insulating layer comprises boron nitride and an inorganic filler other than boron nitride.

Career Highlights

Rui Zhang is associated with Sekisui Chemical Co., Ltd., where he applies his expertise in developing advanced materials. His work has been instrumental in creating solutions that meet the demands of modern electronic applications.

Collaborations

Rui Zhang collaborates with notable colleagues, including Kouji Ashiba and Keigo Oowashi. Their combined efforts contribute to the advancement of innovative technologies in their field.

Conclusion

Rui Zhang's contributions to thermal conductivity solutions exemplify the impact of innovative thinking in materials science. His patent reflects a commitment to addressing industry challenges and enhancing the performance of electronic devices.