Sekisui Chemical Co., Ltd.

Rui Zhang

Keigo Oowashi

Kouji Ashiba

Aki Koukami

The problem to be solved by the invention is to provide a laminate capable of effectively enhancing thermal conductivity and adhesiveness, in spite of the relatively large thickness of a patterned metal layer. The laminate () according to the present invention includes a metal substrate (), an insulating layer () laminated on one surface of the metal substrate (), and a patterned metal layer () laminated on the surface of the insulating layer () on the side opposite to the metal substrate (), the metal layer () is 300 &#x3bc;m or more in thickness, and the insulating layer () includes boron nitride () and an inorganic filler () other than boron nitride.

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Osaka, Japan

Rui Zhang