The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 09, 2021

Filed:

Jan. 29, 2018
Applicant:

Sekisui Chemical Co., Ltd., Osaka, JP;

Inventors:

Yuko Kawahara, Tsukuba, JP;

Keigo Oowashi, Osaka, JP;

Kouji Ashiba, Osaka, JP;

Masataka Sugimoto, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 101/00 (2006.01); B32B 27/20 (2006.01); B32B 27/26 (2006.01); C08K 3/38 (2006.01); H01B 3/00 (2006.01); H01B 3/30 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
C08L 101/00 (2013.01); B32B 27/20 (2013.01); B32B 27/26 (2013.01); C08K 3/38 (2013.01); H01B 3/004 (2013.01); H01B 3/30 (2013.01); H01L 23/373 (2013.01); B32B 2250/03 (2013.01); C08K 2003/385 (2013.01); C08K 2201/003 (2013.01); C08K 2201/005 (2013.01); C08L 2203/20 (2013.01);
Abstract

Provided is a resin material capable of effectively improving the insulating properties and the thermal conductivity, and effectively controlling the variation in dielectric breakdown strength. A resin material according to the present invention includes first boron nitride aggregate particles, second boron nitride aggregate particles, and a binder resin, and a 10% K value of the second boron nitride aggregate particles is smaller than a 30% K value of the second boron nitride aggregate particles, and a 30% K value of the second boron nitride aggregate particles is smaller than a 10% K value of the first boron nitride aggregate particles.


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