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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10477671 B1

PDFFull Text
Date of Patent:
Nov. 12, 2019

Filed:

Sep. 29, 2016

Laminated body

Applicant:

Sekisui Chemical Co., Ltd., Osaka, Osaka, JP;

Inventors:

Hiroshi Maenaka, Osaka, JP;

Osamu Inui, Osaka, JP;

Assignee:

SEKISUI CHEMICAL CO., LTD., Osaka, JP;

Attorney:

Cheng Law Group, PLLC

Primary Examiner:

Jeremy C Norris

Int. Cl.
CPC ...
H05K 1/02 (2006.01); B32B 15/08 (2006.01); H05K 1/03 (2006.01); B32B 15/092 (2006.01); B32B 15/20 (2006.01); B32B 27/20 (2006.01); B32B 27/26 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 27/34 (2006.01); B32B 27/40 (2006.01); B32B 27/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0207 (2013.01); B32B 15/08 (2013.01); B32B 15/092 (2013.01); B32B 15/20 (2013.01); B32B 27/20 (2013.01); B32B 27/26 (2013.01); B32B 27/281 (2013.01); B32B 27/302 (2013.01); B32B 27/34 (2013.01); B32B 27/40 (2013.01); B32B 27/42 (2013.01); H05K 1/02 (2013.01); H05K 1/0204 (2013.01); H05K 1/0209 (2013.01); H05K 1/0284 (2013.01); H05K 1/0373 (2013.01); B32B 2250/44 (2013.01); B32B 2264/10 (2013.01); B32B 2264/102 (2013.01); B32B 2307/206 (2013.01); B32B 2307/30 (2013.01); B32B 2307/304 (2013.01); B32B 2307/306 (2013.01); B32B 2307/308 (2013.01); B32B 2307/538 (2013.01); B32B 2307/54 (2013.01); B32B 2307/732 (2013.01); B32B 2307/734 (2013.01); B32B 2307/748 (2013.01); B32B 2457/08 (2013.01); H05K 2201/068 (2013.01); H05K 2201/09745 (2013.01);
Abstract

There is provided a laminated body capable of lowering thermal resistance and capable of suppressing peeling off after a cooling/heating cycle. The laminated body according to the present invention includes an insulating resin layer, a first metal material being a metal foil or a metal plate, and a second metal material being a metal foil or a metal plate, the first metal material is layered on a first surface of the insulating resin layer and the second metal material is layered on a second surface opposite to the first surface of the insulating resin layer, the thickness of the insulating resin layer is 200 μm or less, the total thickness of the first metal material and the second metal material is 200 μm or more, the ratio of the thickness of the first metal material to the thickness of the second metal material is 0.2 or more and 5 or less, and the ratio of the surface area of a surface opposite to the insulating resin layer side of the first metal material to the surface area of a surface opposite to the insulating resin layer side of the second metal material is 0.5 or more and 2 or less.

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