On Lok Chau

Title: On Lok Chau: Innovator in Semiconductor Technology

Introduction

On Lok Chau is a prominent inventor based in Hong Kong, CN. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His innovative methods have advanced the way interconnects are formed on substrates, showcasing his expertise and creativity in engineering.

Latest Patents

One of his latest patents is titled "Method for forming reinforced interconnects on a substrate." This method involves creating a support structure on the substrate, followed by the formation of a substantially filled capsule around the support structure to create an interconnect. Notably, these interconnects can reach heights of up to 300 microns. Another significant patent is "Method for forming multi-layer bumps on a substrate." This method includes depositing an adhesive or flux on the substrate, followed by the application of a first metal powder. The adhesive and metal powder are then melted or reflowed to form the first bumps. Subsequently, a second adhesive or flux and a second metal powder are deposited on the first bumps, allowing for the creation of multi-layer bumps without the need for wet chemicals.

Career Highlights

On Lok Chau is currently employed at Freescale Semiconductor, Inc., where he continues to innovate and develop new technologies. His work has been instrumental in enhancing the capabilities of semiconductor devices, making them more efficient and reliable.

Collaborations

He has collaborated with notable coworkers such as Hei Ming Shiu and Gor Amie Lai, contributing to various projects that push the boundaries of semiconductor technology.

Conclusion

On Lok Chau's contributions to the field of semiconductor technology through his patents and collaborative efforts highlight his role as a key innovator. His work continues to influence the industry and pave the way for future advancements.