The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2007
Filed:
Mar. 16, 2005
Hei Ming Shiu, Hong Kong, HK;
On Lok Chau, Hong Kong, HK;
Fei Ying Wong, Hong Kong, HK;
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
An electronic device () including a first integrated circuit (IC) die () electrically connected to a first lead frame () and a second IC die () electrically connected to a second lead frame (). The first lead frame () is electrically connected to the second lead frame () by at least one stud bump (), which is selectively formed where an electrical connection between the first lead frame () and the second lead frame () is required. The first and second lead frames () and (), the first and second IC dies () and (), and the at least one stud bump () are encapsulated by a mold compound () to form a 3D package.