The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2009
Filed:
Mar. 06, 2006
Applicants:
Hei Ming Shiu, Tsuen Wan, HK;
On Lok Chau, Ma On Shan, HK;
Gor Amie Lai, Tseung Kwan, HK;
Heng Keong Yip, Selangor Darul Ehsan, MY;
Thoon Khin Chang, Jalan Cheras, MY;
Lan Chu Tan, Klang, MY;
Inventors:
Hei Ming Shiu, Tsuen Wan, HK;
On Lok Chau, Ma On Shan, HK;
Gor Amie Lai, Tseung Kwan, HK;
Heng Keong Yip, Selangor Darul Ehsan, MY;
Thoon Khin Chang, Jalan Cheras, MY;
Lan Chu Tan, Klang, MY;
Assignee:
Freescale Semiconductor, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for forming reinforced interconnects or bumps on a substrate includes first forming a support structure on the substrate. A substantially filled capsule is then formed around the support structure to form an interconnect. The interconnect can reach a height of up to 300 microns.