Gor Amie Lai

Title: Gor Amie Lai: Innovator in Semiconductor Technology

Introduction

Gor Amie Lai is a prominent inventor based in Hong Kong, CN. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His innovative approaches have paved the way for advancements in interconnect technology.

Latest Patents

One of his latest patents is titled "Method for forming reinforced interconnects on a substrate." This method involves first forming a support structure on the substrate, followed by the creation of a substantially filled capsule around the support structure to form an interconnect. Notably, the interconnect can reach a height of up to 300 microns. Another significant patent is "Method for forming multi-layer bumps on a substrate." This method includes depositing an adhesive or flux on the substrate, followed by the deposition of a first metal powder. The adhesive and first metal powder are then melted or reflowed to form the first bumps. Subsequently, an adhesive or flux and a second metal powder are deposited on the first bumps, which are melted to create second bumps, resulting in multi-layer bumps without the need for any wet chemicals.

Career Highlights

Gor Amie Lai is currently employed at Freescale Semiconductor, Inc., where he continues to innovate and develop new technologies. His work has been instrumental in enhancing the capabilities of semiconductor devices.

Collaborations

Throughout his career, Gor has collaborated with notable colleagues, including Hei Ming Shiu and On Lok Chau. These collaborations have further enriched his contributions to the field.

Conclusion

Gor Amie Lai stands out as a key figure in semiconductor innovation, with a focus on improving interconnect technologies. His patents reflect a commitment to advancing the industry and enhancing the performance of electronic devices.