Nagano, Japan

Noritaka Katagiri

This inventor holds 5 USPTO granted patents. Top assignees: Shinko Electric Industries Co., Ltd., Shinko Electric Industries Inc., Ltd.. Active years: 2002-2026.


% Patents Active = 100.0

Average Co-Inventor Count = 2.6

ph-index = 3

Forward Citations = 50(Granted Patents)


Location History:

  • Nagano, JP (2002 - 2016)
  • Nagano-Ken, JP (2017)

Company Filing History:


Years Active: 2002-2026

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5 patents (USPTO):Explore Patents

Title: Noritaka Katagiri: Innovator in Wiring Substrate Technology

Introduction

Noritaka Katagiri is a prominent inventor based in Nagano, Japan. He has made significant contributions to the field of semiconductor technology, particularly in wiring substrates. With a total of 5 patents to his name, Katagiri continues to push the boundaries of innovation in his industry.

Latest Patents

Katagiri's latest patents include advancements in wiring substrates and semiconductor devices. One notable patent describes a wiring substrate that features a first wiring layer with a first land, a first insulative layer, a second wiring layer, and a second insulative layer. This design includes a via that extends through the insulative layers, allowing for electrical connections to mounted electronic components. Another patent focuses on a bump structure that includes a solder member and a metal layer with a cylindrical portion, enhancing the reliability of electronic connections.

Career Highlights

Noritaka Katagiri is associated with Shinko Electric Industries Co., Ltd., where he has been instrumental in developing innovative technologies. His work has significantly impacted the semiconductor industry, particularly in improving the efficiency and performance of wiring substrates.

Collaborations

Throughout his career, Katagiri has collaborated with notable colleagues, including Toshinori Koyama and Kei Imafuji. These partnerships have fostered a creative environment that has led to groundbreaking advancements in their field.

Conclusion

Noritaka Katagiri stands out as a key figure in the development of wiring substrate technology. His innovative patents and collaborations reflect his commitment to advancing semiconductor technology. His contributions continue to shape the future of the industry.

Profile summary based on public USPTO records.
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