The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 22, 2017
Filed:
Nov. 10, 2011
Shigetsugu Muramatsu, Nagano-Ken, JP;
Noritaka Katagiri, Nagano-Ken, JP;
Shigetsugu Muramatsu, Nagano-Ken, JP;
Noritaka Katagiri, Nagano-Ken, JP;
Shinko Electric Industries Co., LTD., Nagano-Ken, JP;
Abstract
A wiring substrate is provided with a first wiring layer including a first land, a first insulative layer formed on the first wiring layer, a second wiring layer formed on the first insulative layer, a second insulative layer formed on the second wiring layer, and a via formed extending through the first insulative layer and the second insulative layer in a thicknesswise direction. The via includes one end, which is electrically connected to the first land of the first wiring layer, and another end, which is located opposed to the one end and serves as a pad to which a mounted electronic component is electrically connected. The second wiring layer includes a coupling portion electrically connected to the via. The coupling portion of the second wiring has a width that is smaller than a diameter of the via.