The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2004
Filed:
Apr. 17, 2002
Applicant:
Inventors:
Toshinori Koyama, Nagano, JP;
Noritaka Katagiri, Nagano, JP;
Assignee:
Shinko Electric Industries Co., Ltd., Nagano, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 ; H01R 1/204 ;
U.S. Cl.
CPC ...
H05K 1/11 ; H01R 1/204 ;
Abstract
A multilayer wiring board comprising a plurality of conductor patterns stacked with an insulating layer composed of a thermosetting resin interposed between adjacent conductor patterns, wherein the insulating layers are each formed of a pair of film-like thermosetting resin layers and a resin film having a lower coefficient of linear expansion than, and sandwiched between, the thermosetting resin layers, and wherein the electrical connection between the stacked conductor patterns is established by vias formed through the insulating layers. A method of fabricating such a multilayer wiring board is also disclosed.