Location History:
- Kanuma, JP (2002 - 2006)
- Tochigi, JP (2001 - 2010)
Company Filing History:
5 out of 186 
3 out of 122 
2 out of 58,131 
Years Active: 2001-2010
Title: Noriaki Kudo: Innovator in Electric Component Mounting Technologies
Introduction
Noriaki Kudo, hailing from Tochigi, Japan, is a notable inventor recognized for his significant contributions to the field of electric component mounting technologies. With a remarkable portfolio of 9 patents, Kudo has developed innovative methods and devices that enhance the reliability and efficiency of mounting electric components.
Latest Patents
Kudo's recent patents focus on a device for mounting electric components using adhesive technology. His innovative mounting method involves thermocompression bonding of an integrated circuit (IC) chip onto a wiring board employing an anisotropic conductive adhesive film. This method ensures that the top region of the IC chip is pressed against the wiring board with a predetermined pressure, while the side regions experience a lower pressure. The elastomer utilized in the compression bonding portion boasts a rubber hardness between 40 and 80. The adhesive film contains a binding resin with a specific melting viscosity, targeting precise parameters for optimal performance.
Career Highlights
Throughout his career, Kudo has worked with notable companies such as Sony Chemicals Corporation and Sony Chemical & Information Device Corporation. His extensive experience in these esteemed companies has honed his skills in developing advanced mounting technologies that are essential for modern electronics.
Collaborations
Kudo's work has been enriched through collaborations with talented individuals like Minoru Nagashima and Takashi Matsumura. Together, they have contributed to the progression of mounting techniques that reinforce Kudo's impact in the industry.
Conclusion
Noriaki Kudo stands out as an influential inventor in the realm of electric component mounting technologies. His innovative patents and impactful collaborations have paved the way for advancements in the field, ensuring high reliability in the manufacturing processes of electronic devices. His contributions will undoubtedly continue to resonate in future innovations and developments.