Sony Chemicals Corporation

Sony Chemical & Information Device Corporation

Sony Corporation

Other

Circuit Foil Japan Co., Ltd.

Noriaki Kudo

Minoru Nagashima

Satoshi Takahashi

Takashi Matsumura

Shiyuki Kanisawa

Akira Tsutsumi

Yasuhiro Suga

Hisashi Ando

Koji Arai

Koichi Uno

Hiromasa Ota

Akihiro Arai

Osamu Ichihara

Satoshi Oaku

Yoshifumi Ueno

Akitoshi Suzuki

Shin Fukuda

Hiroshi Takamatsu

Asaei Takabayashi

A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive. The mounting method includes thermocompression bonding an IC chip onto a wiring board by using an anisotropic conductive adhesive film. During the thermocompression bonding, a top region of the IC chip is pressed against the wiring board with a predetermined pressure, and a side region of the IC chip is pressed with a pressure smaller than the pressure applied to the top region of the IC chip. An elastomer having rubber hardness of 40 or more and 80 or less is used for a compression bonding portion of a thermocompression bonding head. The anistropic conductive adhesive film contains a binding resin having melting viscosity of 1.0&#xd7;10mPa&#xb7;s or more and 1.0&#xd7;10mPa&#xb7;s or less.

Device for mounting electric component

A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive. The mounting method includes thermocompression bonding an IC chip onto a wiring board by using an anisotropic conductive adhesive film. During the thermocompression bonding, a top region of the IC chip is pressed against the wiring board with a predetermined pressure, and a side region of the IC chip is pressed with a pressure smaller than the pressure applied to the top region of the IC chip. An elastomer having rubber hardness of 40 or more and 80 or less is used for a compression bonding portion of a thermocompression bonding head. The anisotropic conductive adhesive film contains a binding resin having melting viscosity of 1.0&#xd7;10mPa&#xb7;s or more and 1.0&#xd7;10mPa&#xb7;s or less.

Method and device for mounting electric component

A flexible flat cable is provided. The FFC comprises multiple conductors with widths of 0.3(&#xb1;0.03)mm arranged in a parallel manner with a pitch of 0.5 (&#xb1;0.05)mm, the first insular material and the second insular material sandwiching these conductors from both sides, shield material, and the reinforcement board. The first insular material is porous PET possessing a 34 &#x3bc;m thick porous layer and the shield material is a polymer-based shield material possessing a shield layer made of a polymer-based conductive layer equal to or less than 20 &#x3bc;m thick that is a prescribed resin formed including air with uniformly dispersed conductive particles. Due to this, the FFC maintains the shield effect without damaging the electrical characteristics and also, along with being compatible with existing connecters, can combine with the electrical traits by existing processes and furthermore is capable of being established with any number of wires, any length of cable, and any alignment of wiring.

Flexible flat cable

A polyamic acid varnish composition, which is composed of a polyamic acid obtained by the addition polymerization of an diamine and an aromatic acid dianhydride, contains as an additive a specific imidazolyl-diaminoazine.

Polyamic acid varnish composition and a flexible printed board

A flexible printed board contains an unroughened electrodeposited copper foil, a zinc-based metallic layer provided thereon in an amount of 0.25 to 0.40 mg/dm , and a polyimide resin layer formed through the imidation of a polyamic acid layer provided on the zinc-based metallic layer.

Flexible printed wiring board

A flexible printed substrate is constituted of metallic foil and provided thereon a polyimide layer which is produced by forming a film of a polyamic acid varnish on the metallic foil, followed by imidating. The polyimide layer has a linear expansion coefficient of 10&times;10 to 30&times;10 (1/K) and a softening point not more than the imidation temperature.

Flexible printed substrate

A flexible printed circuit board that is intended to minimize curling is formed having a first polyimide-resin layer with a conductor pattern formed on one surface thereof and supporting that conductor pattern. A second polyimide-resin is formed on another surface of the conductor pattern and covers and protects the circuit of the conductor pattern. The polyimide-resin layers are chosen so that a difference between a coefficient of linear thermal expansion of the first polyimide-resin layer and the coefficient of linear thermal expansion of the second polyimide-resin layer is 3&times;10 /K or smaller.

Flexible printed circuit board

Processes for manufacturing flexible printed wiring boards

Growing community of inventors

Tochigi, Japan

Noriaki Kudo