The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2002
Filed:
Jun. 04, 1999
Satoshi Takahashi, Tochigi, JP;
Akira Tsutsumi, Tochigi, JP;
Noriaki Kudo, Tochigi, JP;
Akihiro Arai, Tochigi, JP;
Koji Arai, Tochigi, JP;
Koichi Uno, Tochigi, JP;
Satoshi Oaku, Tochigi, JP;
Osamu Ichihara, Tochigi, JP;
Hiromasa Ota, Tochigi, JP;
Sony Chemicals Corporation, Tokyo, JP;
Abstract
A flexible printed circuit board that is intended to minimize curling is formed having a first polyimide-resin layer with a conductor pattern formed on one surface thereof and supporting that conductor pattern. A second polyimide-resin is formed on another surface of the conductor pattern and covers and protects the circuit of the conductor pattern. The polyimide-resin layers are chosen so that a difference between a coefficient of linear thermal expansion of the first polyimide-resin layer and the coefficient of linear thermal expansion of the second polyimide-resin layer is 3×10 /K or smaller.