The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2010
Filed:
May. 15, 2009
Takashi Matsumura, Tochigi, JP;
Hisashi Ando, Tochigi, JP;
Shiyuki Kanisawa, Tochigi, JP;
Yasuhiro Suga, Tochigi, JP;
Noriaki Kudo, Tochigi, JP;
Takashi Matsumura, Tochigi, JP;
Hisashi Ando, Tochigi, JP;
Shiyuki Kanisawa, Tochigi, JP;
Yasuhiro Suga, Tochigi, JP;
Noriaki Kudo, Tochigi, JP;
Sony Corporation, Tokyo, JP;
Sony Chemical & Information Device Corporation, Tokyo, JP;
Abstract
A mounting method and a mounting device are provided, which can mount an electric component with high reliability by using an adhesive. The mounting method includes thermocompression bonding an IC chip onto a wiring board by using an anisotropic conductive adhesive film. During the thermocompression bonding, a top region of the IC chip is pressed against the wiring board with a predetermined pressure, and a side region of the IC chip is pressed with a pressure smaller than the pressure applied to the top region of the IC chip. An elastomer having rubber hardness of 40 or more and 80 or less is used for a compression bonding portion of a thermocompression bonding head. The anistropic conductive adhesive film contains a binding resin having melting viscosity of 1.0×10mPa·s or more and 1.0×10mPa·s or less.