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For the Inventor, By the Inventor

Ogaki, Japan

Nobuyuki Naganuma

This inventor holds 13 USPTO granted patents. Top assignee: Ibiden Company Limited. Active years: 2012-2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Nobuyuki Naganuma. Retrieved from https://idiyas.com/inventor/nobuyuki-naganuma

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 13

% Patents Active = 53.8

Average Co-Inventor Count = 2.3

ph-index = 4

Forward Citations = 48(Granted Patents)


Company Filing History:

goldMedal13 out of 1,483 
 
Ibiden Company Limited
 patents

Years Active: 2012-2016

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13 patents (USPTO):Explore Patents
1. 9425137 - Wiring board (2016-08-23),
2. 9215811 - Method for manufacturing multi-piece substrate and multi-piece substrate (2015-12-15),
3. 9066439 - Wiring board and method for manufacturing the same (2015-06-23),
4. 8933556 - Wiring board (2015-01-13),
5. 8908377 - Wiring board and method for manufacturing the same (2014-12-09),
6. 8759687 - Flex-rigid wiring board and method for manufacturing the same (2014-06-24),
7. 8658904 - Flex-rigid wiring board and method for manufacturing the same (2014-02-25),
8. 8569630 - Flex-rigid wiring board and method for manufacturing the same (2013-10-29),
9. 8546698 - Wiring board and method for manufacturing the same (2013-10-01),
10. 8493747 - Flex-rigid wiring board and method for manufacturing the same (2013-07-23),
11. 8461459 - Flex-rigid wiring board and method for manufacturing the same (2013-06-11),
12. 8404978 - Flex-rigid wiring board and method for manufacturing the same (2013-03-26),
13. 8334463 - Wiring board and method for manufacturing the same (2012-12-18),

Title: Nobuyuki Naganuma: Innovator in Wiring Board Technology

Introduction

Nobuyuki Naganuma is a prominent inventor based in Ogaki, Japan. He has made significant contributions to the field of wiring board technology, holding a total of 13 patents. His innovative designs and methods have advanced the manufacturing processes in this area.

Latest Patents

Naganuma's latest patents include a sophisticated wiring board design. This wiring board features multiple insulating layers, including first, second, third, fourth, and fifth insulation layers, laminated in a specific order. Each insulation layer contains conductors formed along the same axis, ensuring electrical continuity. Another notable patent is a method for manufacturing a multi-piece substrate. This method involves preparing a first frame with a connecting portion, forming a conductive pattern on a piece substrate, and using laser irradiation to detach the substrate from a second frame, allowing for efficient assembly.

Career Highlights

Nobuyuki Naganuma is currently associated with Ibiden Company Limited, where he continues to innovate in the field of wiring technology. His work has been instrumental in enhancing the efficiency and functionality of wiring boards, making significant impacts in various applications.

Collaborations

Naganuma has collaborated with notable coworkers, including Michimasa Takahashi and Masakazu Aoyama. Their combined expertise has contributed to the successful development of advanced technologies in their field.

Conclusion

Nobuyuki Naganuma's contributions to wiring board technology exemplify his innovative spirit and dedication to advancing manufacturing processes. His patents reflect a commitment to improving efficiency and functionality in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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