The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2013

Filed:

Jun. 04, 2010
Applicant:

Nobuyuki Naganuma, Ogaki, JP;

Inventor:

Nobuyuki Naganuma, Ogaki, JP;

Assignee:

Ibiden Co., Ltd., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
Abstract

A wiring board has a first rigid wiring board having a first wiring layer on a first main surface, a second rigid wiring board having a second wiring layer on a second main surface, a first connection portion connecting the first wiring layer and the second wiring layer, and a first interlayer insulation layer formed on the first wiring layer, the second wiring layer and the first connection portion. In such a wiring board, the first rigid wiring board and the second rigid wiring board are positioned in such a way that the first main surface and the second main surface are set at substantially the same level, and the first wiring layer and the second wiring layer are electrically connected by the first connection portion.


Find Patent Forward Citations

Naganuma, Nobuyuki. (2013). Wiring board and method for manufacturing the same (U.S. Patent No. 8546698). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8546698

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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