The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2015

Filed:

Sep. 30, 2010
Applicants:

Nobuyuki Naganuma, Ogaki, JP;

Michimasa Takahashi, Ogaki, JP;

Masakazu Aoyama, Ogaki, JP;

Inventors:

Nobuyuki Naganuma, Ogaki, JP;

Michimasa Takahashi, Ogaki, JP;

Masakazu Aoyama, Ogaki, JP;

Assignee:

Ibiden Co., Ltd., Ogaki-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/053 (2006.01); H01L 23/12 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4623 (2013.01); H05K 2201/096 (2013.01); H05K 3/4069 (2013.01); H05K 2201/09854 (2013.01); H05K 2201/09563 (2013.01);
Abstract

A wiring board includes a laminated body having first and second surfaces and including first, second and third insulation layers in the order of the first, second and third insulation layers from the first surface toward the second surface. The first insulation layer has a first hole which penetrates through the first insulation layer and includes a first conductor made of a plating in the first hole. The second insulation layer has a second hole which penetrates through the second insulation layer and includes a second conductor made of a conductive paste in the second hole. The third insulation layer has a third hole which penetrates through the third insulation layer and includes a third conductor made of a plating in the third hole. The first, second and third conductors are positioned along the same axis and are electrically continuous with each other.


Find Patent Forward Citations

Naganuma, Nobuyuki. (2015). Wiring board (U.S. Patent No. 8933556). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8933556

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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