Company Filing History:
Years Active: 2004-2015
Title: Nobutoshi Saito: Innovator in Plating Technology
Introduction
Nobutoshi Saito is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of plating technology, holding a total of 12 patents. His work focuses on developing advanced plating apparatuses and methods that enhance the efficiency and quality of electroplating processes.
Latest Patents
One of his latest patents is a plating apparatus designed to form a bump with a flat top or a metal film with excellent in-plane uniformity, even under high-current density conditions. This apparatus includes a plating tank for holding a plating solution, an anode immersed in the solution, and a holder for positioning the plating object opposite the anode. A paddle, which stirs the plating solution, is also part of the design, moving at an average velocity of 70 cm/sec to 100 cm/sec. Another notable patent involves a method for forming a conductive structure useful for three-dimensional packaging with via plugs. This method reduces the conventional long plating time, allowing for a more practical application of electroplating.
Career Highlights
Nobutoshi Saito is currently employed at Ebara Corporation, where he continues to innovate in the field of plating technology. His work has been instrumental in advancing the capabilities of electroplating, making it more efficient and effective for various applications.
Collaborations
He has collaborated with notable coworkers, including Fumio Kuriyama and Rei Kiumi, contributing to the development of cutting-edge plating technologies.
Conclusion
Nobutoshi Saito's contributions to plating technology have significantly impacted the industry. His innovative patents and ongoing work at Ebara Corporation highlight his dedication to advancing electroplating methods.