The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2006
Filed:
Dec. 24, 2003
Masashi Shimoyama, Fujisawa, JP;
Hiroshi Yokota, Fujisawa, JP;
Rei Kiumi, Tokyo, JP;
Fumio Kuriyama, Tokyo, JP;
Nobutoshi Saito, Tokyo, JP;
Masashi Shimoyama, Fujisawa, JP;
Hiroshi Yokota, Fujisawa, JP;
Rei Kiumi, Tokyo, JP;
Fumio Kuriyama, Tokyo, JP;
Nobutoshi Saito, Tokyo, JP;
Ebara Corporation, Tokyo, JP;
Abstract
The present invention relates to a lead-free bump with suppressed formation of voids, obtained by reflowing a plated film of Sn—Ag solder alloy having an adjusted Ag content, and a method of forming the lead-free bump. The lead-free bump of the present invention is obtained by forming an Sn—Ag alloy film having a lower Ag content than that of an Sn—Ag eutectic composition by plating and reflowing the plated alloy film.