The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 25, 2011
Filed:
Mar. 09, 2004
Fumio Kuriyama, Tokyo, JP;
Takashi Takemura, Tokyo, JP;
Nobutoshi Saito, Tokyo, JP;
Masaaki Kimura, Tokyo, JP;
Rei Kiumi, Tokyo, JP;
Fumio Kuriyama, Tokyo, JP;
Takashi Takemura, Tokyo, JP;
Nobutoshi Saito, Tokyo, JP;
Masaaki Kimura, Tokyo, JP;
Rei Kiumi, Tokyo, JP;
Ebara Corporation, Tokyo, JP;
Abstract
A plating apparatus for use in forming a plated film in trenches, via holes, or resist openings that are defined in a surface of a semiconductor wafer, and forming bumps to be electrically connected to electrodes of a package, on a surface of a semiconductor wafer. The plating apparatus has a plating tank for holding a plating solution, a holder for holding a workpiece and bringing a surface to be plated of the workpiece into contact with the plating solution in the plating tank, and a ring-shaped nozzle pipe disposed in the plating tank and having a plurality of plating solution injection nozzles for injecting the plating solution to the surface to be plated of the workpiece held by the holder to supply the plating solution into the plating tank.