Tokyo, Japan

Nobuo Komatsu

This inventor holds 6 USPTO granted patents. Top assignees: Sony Corporation, Other. Active years: 1993-2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Nobuo Komatsu. Retrieved from https://idiyas.com/inventor/nobuo-komatsu-8syg8uyk

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 66.7

Average Co-Inventor Count = 2.8

ph-index = 5

Forward Citations = 80(Granted Patents)


Location History:

  • Higashisumiyoshi-ku, Osaka, JP (1993)
  • Kanagawa, JP (1995 - 1997)
  • Tokyo, JP (2003 - 2005)

Company Filing History:


Years Active: 1993-2005

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6 patents (USPTO):Explore Patents

Title: Nobuo Komatsu: Innovator in Printed Wiring Board Technology

Introduction

Nobuo Komatsu is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of printed wiring board technology, holding a total of 6 patents. His innovative methods have paved the way for advancements in electronic manufacturing.

Latest Patents

One of his latest patents is a method for producing a printed wiring board that reduces weight by minimizing the size and thickness of the substrate. This design includes a rigid substrate made of core material, which features a land on at least one side, and flexible substrates that have bumps for electrical connections. The rigid and flexible substrates are molded together with an adhesive, ensuring that the land and bump are aligned for optimal performance.

Another notable patent involves the manufacturing of a multi-layer printed wiring board. This process includes forming a wiring pattern and component mounting portion on a first substrate, stacking an insulating spacer with a first opening over it, and bonding a second substrate to the assembly. The second substrate is designed with a second opening that aligns with the first, allowing for the mounting of an LSI on the component portion. The assembly is then filled with a synthetic resin mass and enclosed with a third substrate.

Career Highlights

Nobuo Komatsu has worked with notable companies, including Sony Corporation. His experience in the industry has allowed him to develop innovative solutions that enhance the functionality and efficiency of printed wiring boards.

Collaborations

Throughout his career, Komatsu has collaborated with talented individuals such as Kazuhiro Shimizu and Soichiro Kishimoto. These partnerships have contributed to the success of his projects and the advancement of technology in his field.

Conclusion

Nobuo Komatsu's contributions to printed wiring board technology demonstrate his innovative spirit and dedication to advancing electronic manufacturing. His patents reflect a commitment to improving the efficiency and effectiveness of electronic components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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