The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 1997
Filed:
Oct. 13, 1994
Nobuo Komatsu, Kanagawa, JP;
Ikuyo Kai, Tokyo, JP;
Nami Konishi, Tokyo, JP;
Naozumi Iwasawa, Kanagawa, JP;
Satoru Furusawa, Kanagawa, JP;
Sony Corporation, Tokyo, JP;
Abstract
A photopolymerizable composition suitable as a solder resist and capable of forming a resist film having characteristics in no way inferior to those of the conventional heat-curable type or organic solvent developed type solder resist, with the use of water or a dilute aqueous solution which is completely innocuous and higher in safety than the aqueous alkaline solution, and a method for producing a cured coated film pattern using the photopolymerizable composition.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile