The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2005
Filed:
Feb. 12, 2003
Applicants:
Kazuhiro Shimizu, Ishikawa, JP;
Nobuo Komatsu, Tokyo, JP;
Soichiro Kishimoto, Tochigi, JP;
Inventors:
Assignee:
Sony Corporation, , JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K003/36 ;
U.S. Cl.
CPC ...
Abstract
A method for making a printed wiring board reduced in weight by reducing the size and the thickness of a substrate in its entirety. The printed wiring board includes a rigid substrate, comprised of a core materialat least one side of which carries a land, and flexible substrates, andcomprised of core materialson at least one surface of which a bumpfor electrical connection to the landis formed protuberantly. The rigid substrateand the flexible substratestoare molded as one with each other, with the interposition of an adhesive in-between, so that the land and the bump face each other.