Noboru Okane

Title: Noboru Okane: Innovator in Semiconductor Technology

Introduction

Noboru Okane is a distinguished inventor based in Yokkaichi, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His innovative work has paved the way for advancements in wire bonding methods and semiconductor device manufacturing.

Latest Patents

Okane's latest patents include a wire bonding apparatus and a wire bonding method. This method involves bonding a wire at a first bonding point and a second bonding point. It also includes raising a capillary, through which the wire is inserted, on the second bonding point. The process entails cutting the wire by closing a clamper provided above the capillary when the capillary has reached a prescribed height. Additionally, it measures the load incurred on the wire at the time of cutting. Another notable patent is for a semiconductor device and its manufacturing method. This device features a plurality of bare chips stacked on at least one of the first and second main surfaces arranged oppositely on a support substrate. It includes spacers arranged between two bare chips and inner leads connected to pads of the bare chips via bonding wires.

Career Highlights

Noboru Okane is associated with Toshiba Corporation, a leading company in the technology sector. His work has been instrumental in enhancing the efficiency and reliability of semiconductor devices.

Collaborations

Okane has collaborated with notable coworkers, including Junya Sagara and Ryoji Matsushima. Their combined expertise has contributed to the successful development of innovative technologies in the semiconductor field.

Conclusion

Noboru Okane's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence advancements in the field, showcasing the importance of innovation in technology.