The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2009
Filed:
Apr. 06, 2006
Noboru Okane, Yokkaichi, JP;
Ryoji Matsushima, Yokkaichi, JP;
Kazuhiro Yamamori, Yokkaichi, JP;
Junya Sagara, Kawasaki, JP;
Yoshio Iizuka, Yokohama, JP;
Kuniyuki Ohnishi, Kawasaki, JP;
Noboru Okane, Yokkaichi, JP;
Ryoji Matsushima, Yokkaichi, JP;
Kazuhiro Yamamori, Yokkaichi, JP;
Junya Sagara, Kawasaki, JP;
Yoshio Iizuka, Yokohama, JP;
Kuniyuki Ohnishi, Kawasaki, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
A semiconductor device has a plurality of bare chips stacked on at least one of first and second main surfaces oppositely arranged on a support substrate, spacers arranged between two bare chips arranged adjacently in up and down direction among the plurality of bare chips, and inner leads which are arranged at both sides in a horizontal direction of the support substrate and are connected to pads of the bare chips via bonding wires, wherein the bonding wires which connect the pads of the bare chips at one end side of the spacers to the corresponding inner leads, are arranged not to contact the bare chip at the other end side of the same spacer.