The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 2012
Filed:
Sep. 22, 2009
Applicants:
Mitsuhiro Nakao, Yokohama, JP;
Junya Sagara, Kawasaki, JP;
Katsuhiro Ishida, Yokkaichi, JP;
Noboru Okane, Yokkaichi, JP;
Inventors:
Mitsuhiro Nakao, Yokohama, JP;
Junya Sagara, Kawasaki, JP;
Katsuhiro Ishida, Yokkaichi, JP;
Noboru Okane, Yokkaichi, JP;
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 20/00 (2006.01); B23K 31/12 (2006.01);
U.S. Cl.
CPC ...
Abstract
A wire bonding method involves bonding a wire in order at a first bonding point and a second bonding point; raising a capillary, through which the wire is inserted, on the second bonding point; cutting the wire by closing a clamper provided above the capillary at a time when the capillary has reached a prescribed height; and measuring a load incurred on the wire at a time of cutting of the wire.