Tokyo, Japan

Noboru Fujino


Average Co-Inventor Count = 1.9

ph-index = 5

Forward Citations = 65(Granted Patents)


Location History:

  • Musashimurayama, JP (1992 - 2001)
  • Tokyo, JP (1992 - 2022)

Company Filing History:


Years Active: 1992-2022

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11 patents (USPTO):Explore Patents

Title: Noboru Fujino: Innovator in Wire Bonding Technology

Introduction

Noboru Fujino is a prominent inventor based in Tokyo, Japan, known for his significant contributions to the field of wire bonding technology. With a total of 11 patents to his name, Fujino has developed innovative methods and devices that enhance the precision and efficiency of wire bonding processes.

Latest Patents

Fujino's latest patents include a method for calibrating a wire clamp device and a die bonding apparatus. The method for calibrating a wire clamp device involves preparing a wire clamp device with a pair of arm parts designed for clamping a wire. This method includes detecting the timing at which the arms enter a closed state and acquiring a reference voltage to ensure accurate and stable wire bonding. The die bonding apparatus features a position correcting stage with a die carrying surface that is smaller than the die itself, preventing damage to the die's surface during handling.

Career Highlights

Throughout his career, Noboru Fujino has worked with notable companies such as Kabushiki Kaisha Shinkawa and Shinkawa Ltd. His work has significantly impacted the development of advanced wire bonding technologies, making him a respected figure in the industry.

Collaborations

Fujino has collaborated with esteemed colleagues, including Tohru Takamura and Hisashi Ueda, contributing to various projects that have furthered the field of wire bonding.

Conclusion

Noboru Fujino's innovative work in wire bonding technology has established him as a key inventor in this specialized field. His patents reflect a commitment to enhancing the accuracy and reliability of wire bonding processes, making a lasting impact on the industry.

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