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For the Inventor, By the Inventor

Tokyo, Japan

Noboru Fujino

This inventor holds 11 USPTO granted patents. Top assignees: Kabushiki Kaisha Shinkawa, Shinkawa Ltd.. Active years: 1992-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Noboru Fujino. Retrieved from https://idiyas.com/inventor/noboru-fujino

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 11

% Patents Active = 100.0

Average Co-Inventor Count = 1.9

ph-index = 5

Forward Citations = 66(Granted Patents)


Location History:

  • Musashimurayama, JP (1992 - 2001)
  • Tokyo, JP (1992 - 2022)

Company Filing History:

goldMedal10 out of 349 
 
Kabushiki Kaisha Shinkawa
 patents
silverMedal1 out of 136 
 
Shinkawa Ltd.
 patents

Years Active: 1992-2022

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11 patents (USPTO):Explore Patents
1. 11257781 - Method for calibrating wire clamp device (2022-02-22),
2. 6244493 - Die bonding apparatus (2001-06-12),
3. 5501565 - Device for storing thin plate-form parts (1996-03-26),
4. 5372233 - Conveying method and a conveyor control device (1994-12-13),
5. 5307420 - Method and apparatus for monitoring plates in marking device (1994-04-26),
6. 5237924 - Method of printing on workpieces of differing thicknesses (1993-08-24),
7. 5181646 - Lead frame holding apparatus for use in wire bonders (1993-01-26),
8. 5143510 - Lead frame separating device (1992-09-01),
9. 5136948 - Marking method and apparatus (1992-08-11),
10. 5134932 - Self adjusting printing device and method (1992-08-04),
11. 5088401 - Marking method and apparatus (1992-02-18),

Title: Noboru Fujino: Innovator in Wire Bonding Technology

Introduction

Noboru Fujino is a prominent inventor based in Tokyo, Japan, known for his significant contributions to the field of wire bonding technology. With a total of 11 patents to his name, Fujino has developed innovative methods and devices that enhance the precision and efficiency of wire bonding processes.

Latest Patents

Fujino's latest patents include a method for calibrating a wire clamp device and a die bonding apparatus. The method for calibrating a wire clamp device involves preparing a wire clamp device with a pair of arm parts designed for clamping a wire. This method includes detecting the timing at which the arms enter a closed state and acquiring a reference voltage to ensure accurate and stable wire bonding. The die bonding apparatus features a position correcting stage with a die carrying surface that is smaller than the die itself, preventing damage to the die's surface during handling.

Career Highlights

Throughout his career, Noboru Fujino has worked with notable companies such as Kabushiki Kaisha Shinkawa and Shinkawa Ltd. His work has significantly impacted the development of advanced wire bonding technologies, making him a respected figure in the industry.

Collaborations

Fujino has collaborated with esteemed colleagues, including Tohru Takamura and Hisashi Ueda, contributing to various projects that have furthered the field of wire bonding.

Conclusion

Noboru Fujino's innovative work in wire bonding technology has established him as a key inventor in this specialized field. His patents reflect a commitment to enhancing the accuracy and reliability of wire bonding processes, making a lasting impact on the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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