The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2001
Filed:
Jul. 06, 1998
Applicant:
Inventors:
Eiichi Shimazaki, Kokubunji, JP;
Tsutomu Sugimoto, Iruma, JP;
Toshihiro Naoi, Musashimurayama, JP;
Osamu Nakamura, Kokubunji, JP;
Noboru Fujino, Musashimurayama, JP;
Assignee:
Kabushiki Kaisha Shinkawa, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 3/700 ; B23K 5/00 ;
U.S. Cl.
CPC ...
B23K 3/700 ; B23K 5/00 ;
Abstract
In a die bonding apparatus with a position correcting stage that has a die carrying surface upon which a die is placed by a collet, the external circumferential shape of the die carrying surface of the position correcting stage is formed so as to be smaller than the external circumferential shape of the die to be carried on the die carrying surface, thus avoiding damages to the surface of the die.