Iruma, Japan

Tsutomu Sugimoto


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 2001

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1 patent (USPTO):Explore Patents

Title: The Innovations of Tsutomu Sugimoto: A Look at His Contributions to Die Bonding Technology

Introduction: Tsutomu Sugimoto, an innovative inventor based in Iruma, Japan, has made significant contributions to the field of die bonding technology. With a patented invention that addresses critical issues in the manufacturing process, Sugimoto exemplifies the spirit of ingenuity and technical advancement.

Latest Patents: Sugimoto holds a notable patent for a die bonding apparatus. This invention features a position correcting stage equipped with a die carrying surface designed to mitigate damage during the die placement process. Specifically, the outer shape of the die carrying surface is engineered to be smaller than that of the die itself, thereby preventing potential damage to the die surface during operations. This innovation marks a significant improvement in the efficiency and reliability of die bonding systems.

Career Highlights: Tsutomu Sugimoto is associated with Kabushiki Kaisha Shinkawa, a company known for its technological advancements in precision equipment and industrial solutions. His work at the company has focused on enhancing manufacturing processes through innovative design and engineering, making a tangible impact on the industry.

Collaborations: Throughout his career, Sugimoto has collaborated with notable coworkers, including Eiichi Shimazaki and Toshihiro Naoi. These collaborations highlight the importance of teamwork in driving innovation and overcoming challenges within technical fields.

Conclusion: Tsutomu Sugimoto's contributions to die bonding apparatus technology reflect a commitment to improving manufacturing processes. His patent is a testament to the value of innovation in engineering and serves as an inspiration for future advancements in the industry. With a focus on enhancing efficiency and reducing damage, Sugimoto's work continues to influence die bonding technology and exemplify the potential of inventive minds in shaping our technological landscape.

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