Kokubunji, Japan

Eiichi Shimazaki


Average Co-Inventor Count = 4.4

ph-index = 2

Forward Citations = 12(Granted Patents)


Company Filing History:


Years Active: 1999-2001

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2 patents (USPTO):Explore Patents

Title: Innovator Spotlight: Eiichi Shimazaki

Introduction

Eiichi Shimazaki is a prominent inventor based in Kokubunji, Japan, known for his contributions to technology through innovative patent developments. With two patents to his name, Shimazaki has made significant strides in enhancing the efficiency and functionality of electronic assembly equipment.

Latest Patents

Shimazaki's most recent patents include:

1. **Die Bonding Apparatus** - This invention features a die bonding apparatus with a position-correcting stage that has a die-carrying surface. The design specifies that the external circumferential shape of the die-carrying surface is smaller than that of the die, which helps prevent damage to the surface of the die during handling.

2. **Lead Frame Separating and Conveying Apparatus** - This device is designed for use with wire bonding apparatuses. It incorporates a frame separating assembly equipped with frame guides that support vertically aligned lead frames, along with frame suspension guides placed above the front ends of the frame guides. The device utilizes a frame pusher to convey lead frames onto the suspension guides, which support the leads in a suspended position with an inclined frame separating section.

Career Highlights

Eiichi Shimazaki is currently affiliated with Kabushiki Kaisha Shinkawa, where he applies his expertise in the field of electronic assembly technologies. His work has been foundational in improving the efficiency of production processes in the electronics industry.

Collaborations

Throughout his career, Shimazaki has collaborated with esteemed colleagues, including Tsutomu Sugimoto and Toshihiro Naoi. These collaborations have facilitated the exchange of ideas and enhanced the innovation process within their field.

Conclusion

Eiichi Shimazaki's contributions to technology through his innovative patents demonstrate his commitment to advancing the field of electronic assembly. His pioneering work with die bonding and lead frame separating technologies reflects the essential role inventors play in driving progress and efficiency in modern manufacturing processes.

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