Kabushiki Kaisha Shinkawa

Eiichi Shimazaki

Yuji Tanaka

Osamu Nakamura

Noboru Fujino

Michio Yonemoto

Toshihiro Naoi

Tsutomu Sugimoto

Mitsuo Kosuda

In a die bonding apparatus with a position correcting stage that has a die carrying surface upon which a die is placed by a collet, the external circumferential shape of the die carrying surface of the position correcting stage is formed so as to be smaller than the external circumferential shape of the die to be carried on the die carrying surface, thus avoiding damages to the surface of the die.

Die bonding apparatus

A lead frame separating and conveying device used with, for instance, a wire bonding apparatus, including a frame separating assembly that includes frame guides which support lead frames that are lined up with the flat surfaces in a vertical direction, frame suspension guides which are installed above the front ends of the frame guides in the feeding direction of the lead frames, and a frame pusher which pushes the rear end of the lead frames lined up on the frame guides so as to convey the lead frames onto the frame suspension guides. The frame suspension guides supports the lead frames in a suspended fashion and have frame separating sections which are inclined upward.

Lead frame separating and conveying apparatus

Growing community of inventors

Kokubunji, Japan

Eiichi Shimazaki