Kabushiki Kaisha Shinkawa

Shinkawa Ltd.

Noboru Fujino

Tohru Takamura

Hisashi Ueda

Osamu Nakamura

Hiroshi Ushiki

Nobuyuki Aoyagi

Ryuta Yamaguchi

Eiichi Shimazaki

Toshihiro Naoi

Tsutomu Sugimoto

A method for calibrating a wire clamp device includes: preparing a wire clamp device provided with a pair of arm parts having tips for clamping a wire, the arms extending from the tips toward base ends, and a drive part provided with a piezoelectric element for drive, connected to the base ends of the pair of arm parts and opening/closing the tips of the pair of arm parts; a step of detecting, by electrical continuity between the tips, a timing at which the pair of arm parts enters a closed state when the piezoelectric element for drive is driven, and acquiring a reference voltage; and a step of calibrating, on the basis of the reference voltage, an application voltage to be applied to the piezoelectric element for drive. Thus, it is possible to perform accurate and stable wire bonding.

Method for calibrating wire clamp device

In a die bonding apparatus with a position correcting stage that has a die carrying surface upon which a die is placed by a collet, the external circumferential shape of the die carrying surface of the position correcting stage is formed so as to be smaller than the external circumferential shape of the die to be carried on the die carrying surface, thus avoiding damages to the surface of the die.

Die bonding apparatus

A device for storing plate-from parts such as lead frames including an elevator which carries and positions a storing magazine that receives the lead frames and a loading conveyor which conveys the lead frames to the storing magazine. The loading conveyor is computer-operated so as to shift via a feed screw in a horizontal and perpendicular direction relative to a direction in which the lead frames are transferred. The line position of the loading conveyor is automatically adjusted to match the line position of a transporting conveyor which supplies the lead frames to the loading conveyor and also to match the line position of the storing magazine.

Device for storing thin plate-form parts

In a conveyor system including a plurality of processing devices such as wire bonders that are lined-up and supplied with workpieces via a plurality of individually operated conveyors that are aligned linearly, when one (or more) processing device is ready to perform its processing such as bonding, a stopper installed in front of the processing device is raised to stop the conveyance of the workpiece, and when a sensor provided near the conveyor senses the conveyed workpiece, the conveyor is temporarily stopped and then rotated again for a fixed period of time or is slowed down in speed and then rotated for a fixed period of time or a fixed distance. Thus, a workpiece being conveyed is slowed down and therefore avoided from hitting the stopper at a high speed. Thus, the workpiece is prevented from being damaged at the front edge. Also, since the workpieces do not bounce back, they are stopped at the same stopping positions.

Conveying method and a conveyor control device

A method for monitoring conditions of printing plates in a marking device which uses relief-plate printing. The method employs a camera installed beneath a movable printing plate so that the condition of the printing plate is checked via the camera. A device utilizing such a method includes a plate holder to which the printing plate is attached, an X-Y-Z driver which moves the plate holder in X, Y and Z directions, a camera installed with its photographing side facing up and positioned away from a workpiece carrying table which positions and carries a workpiece that is to be printed, an image processor which processes image signals from the camera, and a monitor which displays images in accordance with the output of the image processor. Thus, the printing plate is photographed by the camera and its condition is checked.

Method and apparatus for monitoring plates in marking device

In a marking method and apparatus which uses relief-plate printing, the distance between printing plate and surface of a workpiece is calculated based upon a rotational position of a vertical direction driving motor before the lowering of the printing plate and a rotational position of the vertical direction driving motor at the time the printing plate comes into contact with the workpiece and signal is accordingly generated by a detector. Thus, the distance between the printing plate and the surface of the workpiece can be easily calculated, and even if the workpieces are not the same in thickness, the amount the plate holder is lowered can be set easily and in a short period of time.

Method of printing on workpieces of differing thicknesses

A lead frame holding apparatus for wire bonding machines forcing an upward movement of a heater block and a frame retainer by a heater block raising-and-lowering cam and a frame retainer raising-and-lowering cam and a downward movement of the heater block and frame retainer via a spring force. When the heater block is raised and approaches its upper limit position, the frame retainer is raised by this upward motion of the heater block, thus positioning the lead frame at a standard bonding level.

Lead frame holding apparatus for use in wire bonders

A lead frame separating device which picks up lead frames stored in a lead frame magazine has downwardly urged detection probes which come in contact with the uppermost lead frame raised by a lead frame lift and a detection sensor which detects movement of the detection probes. With signals from the sensor, a chuck picks up the lead frame.

Lead frame separating device

In performing markings in semiconductor manufacturing devices, the positional discrepancy between printing plate and plate holder is first detected by a camera. After correcting such a discrepancy, the printing plate is positionally fixed and then printing is performed. The printing plate is rotated and moved horizontally in any directions when positional discrepancy is detected and corrected, and an image signal of such positional discrepancy supplied from the camera which is set to face the plate holder is processed to be shown on a monitor for executing correction of the discrepancy.

Marking method and apparatus

A marking device and method using a plate holder with a printing plate attached, an X-Y-Z driver which moves the plate holder in the X, Y and Z directions, a camera installed downstream of the printing position on a work piece feeding line so that the camera photographs the character width and position of the character printed on the work piece, and a computer which calculates the difference between the width of the printed character and predetermined standard character width and/or the discrepancy in the printed character position. The computer further alters, for the next work piece, the amount of imprinting movement of the printing plate into the work piece and/or the printed character position by controlling the X-Y-Z driver based upon the data representing the difference in the printed character width and/or the data representing the discrepancy in the printed character position.

Self adjusting printing device and method

In the marking method and apparatus, a printing plate which is mounted to a plate holder is moved horizontally and vertically and set above a workpiece. The printing plate is then lowered quickly until it comes into contact with the workpiece upon which printing is performed and then, based upon a signal from a detector which detects such a contact of the printing plate to the workpiece, the printing plate is further lowered slowly a predetermined fixed distance. Thus, even if the thickness of the workpiece is different from workpiece to workpiece, the pressing-in amount of the printing plate into the workpiece can be constant for different workpieces.

Growing community of inventors

Tokyo, Japan

Noboru Fujino