Company Filing History:
Years Active: 1977-1993
Title: Innovations by Nicholas G. Koopman
Introduction
Nicholas G. Koopman is a prominent inventor based in Hopewell Junction, NY (US). He has made significant contributions to the field of electronics, holding a total of 11 patents. His work primarily focuses on advanced solder interconnections and bonding techniques for semiconductor devices.
Latest Patents
One of his latest patents is titled "Method of forming dual height solder interconnections." This invention relates to a new interconnection method, specifically an elongated solder interconnection. The process involves forming a pad on an electronic carrier, where a solder mass is deposited and capped with a metal layer. This method allows for the creation of additional elongated solder interconnections by forming a second solder mass on the first, which has been capped. Furthermore, the encapsulating layer can also be in the form of a sidewall spacer on the solder mass. Another notable patent is "Palladium enhanced soldering and bonding of semiconductor device contacts." This invention enhances fluxless bonding in a reducing atmosphere for integrated circuit contacts containing copper. It utilizes a palladium layer to inhibit copper oxide formation and promote wetting during fusion.
Career Highlights
Nicholas G. Koopman has had a distinguished career at the International Business Machines Corporation (IBM). His innovative work has significantly impacted the electronics industry, particularly in improving soldering techniques and semiconductor device reliability.
Collaborations
Throughout his career, he has collaborated with notable colleagues, including Kamalesh K. Srivastava and Paul A. Totta. These collaborations have further advanced the research and development of new technologies in the field.
Conclusion
Nicholas G. Koopman is a key figure in the realm of electronics innovation, with a strong portfolio of patents that reflect his expertise and contributions. His work continues to influence the development of advanced soldering techniques and semiconductor technologies.
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