The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 1982
Filed:
Apr. 10, 1980
Applicant:
Inventors:
Nicholas G Koopman, Hopewell Junction, NY (US);
Vincent C Marcotte, La Grangeville, NY (US);
Stephen Teed, Wappingers Falls, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ; B23K / ; B23K / ;
U.S. Cl.
CPC ...
228231 ; 2281 / ; 228223 ; 148 23 ; 148 24 ; 420563 ; 420570 ;
Abstract
Extraction of non-lead components (e.g. tin, indium, etc.) from solder joints with monocarboxylic acids of alkylated hydrophenanthrene nuclei to increase the lead content of the solder joints.
Quick Actions:
Koopman, Nicholas. (1982). Process for in-situ modification of solder comopsition (U.S. Patent No. 4332343). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4332343
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile