The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 1993
Filed:
Mar. 11, 1991
Applicant:
Inventors:
Chin-An Chang, Peekskill, NY (US);
Nicholas G Koopman, Hopewell Junction, NY (US);
Judith M Roldan, Ossining, NY (US);
Steven Strickman, Reading, PA (US);
Kamalesh K Srivastava, Wappingers Falls, NY (US);
Helen L Yeh, Katonah, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257750 ; 257762 ; 257768 ; 228123 ; 2281802 ; 228215 ; 228220 ;
Abstract
The fluxless bonding in a reducing atmosphere of integrated circuit contacts containing copper is enhanced using a layer of 200 to 1500 Angstrom thick palladium which inhibits copper oxide formation before fusion and reduces all oxides to promote wetting during fusion.
Quick Actions:
Chang, Chin-An. (1993). Palladium enhanced soldering and bonding of semiconductor device contacts (U.S. Patent No. 5225711). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5225711
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile