Neng Liu

Title: Neng Liu: Innovator in Electronic-Photonic Integrated Circuits

Introduction

Neng Liu is a prominent inventor based in Montreal, Canada, known for his contributions to the field of electronic-photonic integrated circuits. With a total of 4 patents, Liu has made significant advancements in technology that bridge the gap between electronic and photonic systems.

Latest Patents

Liu's latest patents include innovative designs that enhance the functionality and efficiency of integrated circuits. One of his notable inventions is a chip-carrier socket for microfluidic-cooled three-dimensional electronic/photonic integrated circuits. This invention features a carrier bottom and top that enclose an EPIC assembly, providing electrical connectivity through conductive vias and incorporating fluid inlet and outlet ports. Another significant patent is for a radio-frequency three-dimensional electronic-photonic integrated circuit, which integrates RF antennas and photonic devices into a single circuit, allowing for advanced communication capabilities.

Career Highlights

Neng Liu is currently employed at Telefonaktiebolaget Lm Ericsson (publ), where he continues to push the boundaries of technology in the telecommunications sector. His work focuses on developing integrated circuits that improve the performance of electronic and photonic systems.

Collaborations

Throughout his career, Liu has collaborated with esteemed colleagues such as Robert Frank Brunner and Stephane Lessard, contributing to a dynamic environment of innovation and research.

Conclusion

Neng Liu's work in electronic-photonic integrated circuits exemplifies the intersection of technology and innovation. His patents reflect a commitment to advancing the field and improving communication technologies.